Wireless Communication

3x Faster

The ultimate semiconductor sandwich for wireless communication chips

2X power density
2x voltage
3x smaller
2x farther

The GaN semiconductor powers an increasing range of the most potent wireless communication.

Diamond wafers boost GaN to outperform SiC on every single metric by solving its overheating and voltage problem.

GaN-on-Diamond MOSFET achieves triple the power density of GaN without diamond.

Reliability is boosted through reduced thermal stress and GaN atomically interconnected to DF single-crystal diamond.

Learn more about the innovations that have made this possible.


We are working with RF chip leaders to shape the future.