The ultimate semiconductor sandwich for wireless communication chips
2X power density
The GaN semiconductor powers an increasing range of the most potent wireless communication.
Diamond wafers boost GaN to outperform SiC on every single metric by solving its overheating and voltage problem.
GaN-on-Diamond MOSFET achieves triple the power density of GaN without diamond.
Reliability is boosted through reduced thermal stress and GaN atomically interconnected to DF single-crystal diamond.
Learn more about the innovations that have made this possible.
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