SiC-on-Diamond
Diamond Electronics
10x Smaller
Leapfrogging power electronics
The fortuitous combination of our diamond wafer’s extreme thermal conductivity as well as their extreme electrical insulation solve a longest-standing challenge in power electronics and enable leapfrog new architectures.
Introducing
DF
Power Inverter
+ compact
+ lightweight
+ efficient
Demonstrating 10x miniaturization in power electronics
Tesla
Power Inverter
power (KW):250
Sic chips: 48
Volume (L): 28
Density (kW/L): 9
DF Power Inverter
power (KW):250
Sic chips: 18
Volume (L): 0.46
Density (kW/L): 500
Learn more about the innovations that have made this possible.
Partners
We are working with automotive leaders to shape the future.
Other industries accelerated by our wafer
DF Insights
Our latest news and industry know-how.