Power Electronics

6x Smaller

Simplifying inverter architecture

The diamond wafer’s extreme properties of thermal conductivity and electrical insulation enable novel architectures that radically advance miniaturization, efficiency, and robustness.


DF Perseus
Power Inverter

+ compact
+ lightweight
+ efficient

The next-level miniaturization in power electronics

Power Inverter

power (KW):250

Sic chips: 48

Volume (L): 28

Density (kW/L): 9

DF Perseus
Power Inverter

power (KW):250

Sic chips: 18

Volume (L): 0.46

Density (kW/L): 500

Learn more about the innovations that have made this possible.


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