AI & Cloud Compute

3x Faster

Accelerating silicon chips through the ultimate heat-dissipation solution

Diamond wafers provide a thermal superhighway within atomic distance of hard-working chip transistors. It dissipates heat with ideal efficiency, reducing hotspots and enabling chips to compute up to three times faster.

Our solution works with all leading high-power chips

The combination of proven silicon chips with a diamond semiconductor substrate drastically accelerates cloud and AI compute, which means the same performance using half the space of a data center.

Learn more about the innovations that have made this possible.


We are working with AI & cloud leaders to shape the future.