AI & Cloud Compute
Accelerating silicon chips through the ultimate heat-dissipation solution
Diamond wafers provide a thermal superhighway within atomic distance of hard-working chip transistors. It dissipates heat with ideal efficiency, reducing hotspots and enabling chips to compute up to three times faster.
Our solution works with all leading high-power chips
The combination of proven silicon chips with a diamond semiconductor substrate drastically accelerates cloud and AI compute, which means the same performance using half the space of a data center.
Learn more about the innovations that have made this possible.
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