Diamond AI Chips
Up to 10x faster
Less energy
Longer lifetime
Accelerating silicon chips through the ultimate heat-dissipation solution
Diamond wafers provide a thermal superhighway within atomic distance of hard-working chip transistors. It dissipates heat with ideal efficiency, reducing hotspots and enabling chips to compute up to three times faster.
Hotspots eliminated
DF Bondable Diamond Substrates reduce AI chip hotspot temperatures by a staggering 52ºC, enabling unprecedented power densities of 34W/mm².
The impact of this is A. chips can be run much faster with higher power; and B. they last longer as much as 2x for every 10 degree temperature reduced.
Depending on a chip's heat map, up to 15x more power and speed can be realized.
Works with all leading high-power chips
The combination of proven silicon chips with a diamond semiconductor substrate drastically accelerates cloud and AI compute, which means the same performance using a fraction of the space of a data center. (Details in Physics Journal)
Make AI CapEx investible
AI chips are running very hot these days — a risk for failure before substantive capital expenditure is depreciated.
Diamond is the ultimate, robust, solid-state thermal solution that works with standard liquid cooling and proven facility infrastructure for liquid cooling.
No risk of micro channels clogging due to particulate contamination from a datacenter liquid infrastructure that is not fab level.
Robust
Solid-state, works with proven (non-micro) liquid cooling
Future proof
Thermally optimal
High ROI
For <5% cost adder, up to 4x more compute, 4x FLOPS / building sqft, etc.
Save energy
Up to 50% lower kWh / FLOPS possible — as leakage loss is exponential with temperature
Durable
AI CapEx requires chips that actually last their depreciation period — and longer
Avoiding these future WSJ headlines:
“Even trace particulates can clog micron-scale channels, causing thermal runaway and permanent device degradation”
“Rising junction temperatures and shortened mean time to failure pressure capital expenditure planning”
“Thermal hot spots, electromigration and accelerated transistor degradation raise questions about depreciation assumptions”
“Sub-50µm particles in non-cleanroom environments can obstruct microchannels and irreversibly damage accelerators”
“Advanced microchannel cooling requires particulate control closer to fab standards than typical facility operations provide”
Learn more about the innovations that have made this possible.
We are working with AI & cloud leaders to shape the future.
Other industries boosted into the Diamond Age
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