DF Tech Stack
Over a decade, we have designed, developed, and built from scratch the entire suite of technologies required to create the most extreme material in the universe and to integrate it with semiconductors.
The DF Tech Stack is exclusively used in our own operations.
DF Wafer Heteroepitaxy
No wafer-sized diamond existed anywhere on Earth, so we had to figure out how to create the first “mother” wafer used to produce more. We employ a technology of mind-boggling complexity called diamond heteroepitaxy that allows single-crystal diamond creation on scalable substrates.
DF Ingot Growth Reactor
Our reactor technology is now in its tenth generation, with higher quality, yield, and productivity achieved in each one. Each of our reactor generations has pushed the plasma to more efficient profiles, nearer to the ideal shape of a flat plasma stretched across a large area disk, which is highly unstable and difficult to achieve.
DF Wafer Singulator
The challenge of achieving single-crystal diamond wafers does not end with the creation of a wafer-sized mother crystal. Next is the challenge of how to slice the hardest material on Earth.
DF Wafer Finish
We have developed cost-effective ways of finishing the surface of a diamond wafer to semiconductor-grade requirements: a flatness of as little as one single atom up or down over inches of distance.
DF Bondable Diamond Substrates
Together with our chip industry partners, we have developed three types of diamond surface finishes and associated 300mm IC wafer bonding processes compatible with tier-1 semiconductor wafer bonding equipment and the low pressures and low temperatures required by integrated circuits.
Options include metallized surface finish usable with Thermal Compression Bonding, Pressureless Sintering; and polished surface finish usable with Surface Activated Bonding and Plasma Activated Bonding. (Details in Physics Journal)
DF Power Electronics
Our DF Power business unit has developed complete power electronics components, modules, and systems based on boosting SiC chips with our diamond substrates.
DF Diamond MOSFETs
In partnership with Stanford University, we have designed, developed, and built a new generation of diamond native transistors at DF.
