DF Chip Bondable SCD Substrate
Single-crystal diamond (SCD) substrates bondable to chip wafers with respective low-temperature low-pressure processes developed by DF are available in two surface finish options.
- Thermal conductivity: 2,200 W/m/K (isotropic; at room temperature)
- Breakdown voltage: 4.2 kV/300um
- Dimensions: 18x18m * 300µm (+/-25um)
- TTV: <25µm
- Carats: 1.7
About Product
Basic
- Bondable: Using metallic films using sintering and thermo compression.
- Sa: <1µm
Price per unit:
$
18
Place order
Samples generally ship within 48 hrs. Shipping & handling charges apply.
Polished
- Bondable: Using Plasma Assisted Fusion Bonding or Surface Assisted Bonding.
- Sa: <0.5nm (on the polished side)
Price per unit:
$
23
Place order
Samples generally ship within 48 hrs. Shipping & handling charges apply.
Documents
Datasheet
Design resources
Application Notes